products

Cleaning and activation - low pressure plasma system

The Henniker Plasma 'HPT' range of low pressure plasma treatment systems are microprocessor controlled benchtop devices that are ideal for routine laboratory, R&D and light industrial tasks. Due to their ease of use and reliability, they are the instrument of choice for many of the world's leading companies and institutes, where they are used to activate materials in order to increase wettability and improve adhesion.

Each device includes an integrated pressure gauge and precision gas flow controller as well as a suitable vacuum pump, everything needed for operation. Simple recipes are stored via the intuitive touch screen control and are executed with a single button press and, because we do not use analogue timers or unreliable needle valves, process repeatability is guaranteed each and every time.

Henniker Plasma's HPT plasma systems are perfect for surface cleaning, surface preparation and surface modification of a wide range of materials including metals, glass, polymers, ceramics, plastics and composites. Key applications include composites joining development, microfluidics PDMS bonding, microscope sample cleaning, optics cleaning, metals cleaning, biomedical applications, polymer science and medical device manufacture.

The following table provides an Plasma Surface Activation Systems:

HPT-100
table-1.png
HPT-200
table-2.png
HPT-300
table-2.png
HPT-500
table-2.png
Enclosure Dimensions [mm]: 520 x 286 x 550 520 x 286 x 550  533 x 466 x 615  533 x 600 x 615
Weight: 22 kg 23 kg  40 kg  45 kg
Chamber Material: Stainless Steel Stainless Steel  Stainless Steel  Stainless Steel
Chamber Form: Cylindrical Cylindrical  Cylindrical in standard; Rectangular as option  Cylindrical in standard; Rectangular as option
Chamber Dimensions: 100mm dia. x 280mm L 150mm dia. x 280mm L 200mm dia. x 320mm L 250mm dia. x 410mm L
Carrier material: Aluminium in standard; Stainless steel, borosilicate glass, quartz glass - as option Aluminium in standard; Stainless steel, borosilicate glass, quartz glass - as option  Aluminium in standard; Stainless steel, borosilicate glass, quartz glass - as option  Aluminium in standard; Stainless steel, borosilicate glass, quartz glass - as option
Carrier form: Flat Try in standard; Perforated tray – as option; Flat Try in standard; Perforated tray – as option;  Flat Try in standard; multi-level shelf – as option;  Flat Try in standard; multi-level shelf – as option;
Carrier dimensions: 90mm W x 255mm L in standard; Others to suit application – as option 135mm W x 255mm L in standard; Others to suit application – as option 190mm W x 310mm L in standard; Others to suit application – as option 240mm W x 400mm L in standard; Others to suit application – as option
Plasma power: 1-100 W 1-200 W 1-250 W 1-300 W
Plasma frequency: 40 kHz constant 40 kHz constant  40 kHz constant  40 kHz constant
User Interface: 5.7” Colour TFT 5.7” Colour TFT 5.7” Colour TFT 5.7” Colour TFT
Gas channels: x1 MFC in standard; x2 MFC and x1 vapour inlet as option x1 MFC in standard; x2 MFC and x1 vapour inlet as option x1 MFC in standard; x2 MFC and x1 vapour inlet as option x1 MFC in standard; x2 MFC and x1 vapour inlet as option
Vent Inlet: x1 x1 x1 x1
Connections: 6mm compression 6mm compression 6mm compression 6mm compression
Process Timer: 1sec – 99.59 min 1sec – 99.59 min 1sec – 99.59 min 1sec – 99.59 min
Pressure Gauge: Pirani sensor Pirani sensor Pirani sensor Pirani sensor
Vacuum Pump: 2-stage rotary* 2-stage rotary* 2-stage rotary* 2-stage rotary*
Electrical: 110 or 250AC, 50-60Hz,450VA ( including pump)** 110 or 250AC, 50-60Hz,450VA ( including pump)** 110 or 250AC, 50-60Hz,680VA ( including pump)** 110 or 250AC, 50-60Hz,750VA ( including pump)**
Standard compliances: CE, RoHS CE, RoHS CE, RoHS CE, RoHS

* Suitable to use with air, oxygen and other non-corrosive gases

** Supply voltage and frequency has to be specified with order

Configuration Options:

  • Lab/process scale chamber volumes starting from 100mm diameter
  • Industrial scale plasma activation systems for large parts/high throughput
  • Multiple shelf configurations
  • Easy to use TFT software control
  • Pre- and post-treatment surface test apparatus